Mantis closes second round financing
Mantis, a leading European WMS/logistics software vendor, today announced that it has raised growth equity financing by Odyssey Venture Partners.
The infusion of capital comes at a time of an excellent business momentum for Mantis. The company has been successfully expanding in several countries and has recently released major new software modules and solutions that greatly enhance its state-of-the-art flagship Logistics Vision software suite.
The investment will be used to support Mantis’ expansion in the United States and other countries, as well as the continued innovation in its WMS/logistics platform that is already used in 22 countries by more than 400 companies with many of them being top multinationals in logistics, distribution, retail and manufacturing.
Mantis is poised to take advantage of the lack of enterprise-scale highly adaptable logistics software and solutions. Mantis’ Logistics Vision Suite is the only WMS/logistics information system in the world that can be easily adapted for large enterprises with sophisticated performance needs. Mantis makes this claim, having successfully outperformed some of thу best competitive systems on the market.
Odyssey Venture Partners, based in Palo Alto and Athens, invests in early stage internet and software companies. The new investor joins existing first round investor Vectis Capital.
“Securing equity funding fro Odyssey is strong affirmation of the growth prospects for Mantis,” explained Yiannis Panagiotopoulos, President and CEO, Mantis.
“Mantis has created a unique and innovative platform that represents a great leap in WMS/logistics technology, offering true adaptability flexibility which enables speedy implementations meeting even the most demanding requirements of large enterprises with ease - and helping them to achieve an unbeatably fast ROI + low TCO,” says Spyros Trachanis Managing Partner, Odyssey VP and continues “We are excited to partner with the team at Mantis to accelerate its international expansion and product innovation”